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Manufacturers
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Blue Tape
LED/ Semiconductor Dicing & Die Carrier Tape
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QFN Backside Tape
Product Description
QFN (Backside Tape) tape is attached to the back of the lead frame to prevent leakage of EMC during EMC molding.
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FOBA DP 50
Advantages • Output power 50 Watt (CW) • High laser beam quality • Compact design means easy integration • No external cooling water • Long
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FOBA DP 100
Advantages
• Output power 50 Watt (CW) • High laser beam quality • Compact design means easy integration • No external cooling
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FOBA M1000 Series
The compact manual fiber laser marking machine FOBA M1000 has been designed for the high-quality laser marking of small parts, medium sized
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FOBA M2000 Series
Advanced laser workstations with integrated vision inspection for economic direct part marking and reliable product traceability
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FOBA M3000 Series
Advanced laser workstations with vision inspection for economic direct part marking and reliable product traceability
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FOBA C. 0100
A tiny CO2 laser marker for big tasks in the electronics industry
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FOBA C. 0102 / C. 302
Reliable, field-proven CO2 laser marking technology combined with unrivaled flexibility
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IFLEX
The iFlex adds flexible production, matching the industry trend towards high-mix production. iFlex virtually eliminates product change-over times
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iX Series
The K&S iX series has continuous enhancements in the total pick and place process, further introducing a new light weight feeding range with proven
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Auto Cutting Laminator for PCB
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Automatic Exposure System
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MB PALAMAX®
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ESIM PERSO
Technology for mobile high speed communication
Wearable gadgets, smart appliances and a variety of future data-sensor applications are often
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DS VARIATION ECOline
Most flexible and cost-efficient handling system
Mühlbauer’s overall goal with the DS VARIATION ecoLINE is to significantly lower the initial
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DS MERLIN TAPE & REEL
The world‘s No. 1 in Die Sorting
With the latest DS Merlin, Mühlbauer was able to achieve a new record throughput of up to 45,000 UPH –
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DS MERLIN WAFER-TO-WAFER / WAFER-TO-PANEL
High speed wafer-to-wafer / wafer-to-panel
With the new DS MERLIN, Mühlbauer was able to achieve a new record throughput of more than
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DS Laser
The most gentle method of die handling
With the new DS Laser, Mühlbauer has developed a particularly gentle die handling method. Instead
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Production Equipment
Mühlbauer Die Sorting Setting the benchmark in WLCSP flip chip die sorting
Mühlbauer's Die Sorting systems are world leading in terms of
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Hyper-Pro ®
Wafer Blade Sawing Solution Surface Active Agent Products : Hyper-Pro ® Selecting the Best Material - Reduce Surface Tension(31dynes/cm) and
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Hyper-Star ®
Coating for thermal contamination
- Quality Improvement with Reduce the Temperature on Laser contact surface and Prevent Particle
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Hyper-Max ®
Professional Flux Cleaning : Flux, condensate, oil Dust and other contaminations from condensation - Bubbles occur minimum - Optimized upon
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Hyper-Blue ®
Product Function Photo Resist as a core material is used in the lithographic process for semiconductor circuit elements manufacturing
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