PKG EMI Shield Tape 
Mold Release Film
UV Dicing Tape
Blue Tape
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Product Description
QFN (Backside Tape) tape is attached to the back of the lead frame to prevent leakage of EMC during EMC molding.
QFN (Backside Tape) tape is attached to the back of the lead frame to prevent leakage of EMC during EMC molding.
Product Structure:
Application:
- Sputter & Spray for PKG EMI Shielding
- QFN Leadframe backside tape
Film Properties:
- Good heat resistance, stable adhesion at high temperature
- Residual and Excellent Wire-Bonding
- No flash burr in EMC molding process
- Superior Lead Frame Warpage Control
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