ADVANTAGES:
- Low investment cost for maximal flexibility
- Up to 12” (300 mm) reconstructed wafer
- Fast conversion time between different products
- Flexible output configuration with 2 indexer (2-in-1)
Benifits
- Combined process capability 4-in-1
» Tape and reel
» Waffle pack and Jedec tray sorting
» Reconstructed wafer
»Wafer, tray and de-taping capability
- Including flip chip and 100% 6-side inspection
» Defect detection of 10µm defects and 5µm on sidewall
» NEW infrared sidewall inspection
- Highest placement accuracy
» ±30µ with DOT ±20µm
THROUGHPUT:
- Flip: Up to 6,000 dies/hour
- None-flip: Up to 5,000 dies/hour
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