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Manufacturers
Hojin Platech Co. Ltd.
Kulicke and Soffa
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Hakuto Co. Ltd.
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P-312 ®
Cerium polishing powder Cleaning Solution : P-312 ® To follow newest trend changing to complex design, it is special purpose solution to remove
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FMN
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METALNOX® M6319
KYZEN’s METALNOX products are Solvent and Aqueous precision cleaning metal finishing chemistries specifically formulated for removing tough soils and
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P-412 ®
Finger scan sensor PKG Cleansing Solution : P-412 ® As the range of biometric technology(finger scan sensor) is expanding due to convenience,
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Cleaner S-20
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METALNOX® M6321
KYZEN’s METALNOX products are Solvent and Aqueous precision cleaning metal finishing chemistries specifically formulated for removing tough soils and
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P-512 ®
This P-512 is a special purpose wrapping film which makes protective layer on sensitive wafer surface that is developed to protect from arising
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Supra Clean D-70
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METALNOX® M6324
KYZEN’s METALNOX products are Solvent and Aqueous precision cleaning metal finishing chemistries specifically formulated for removing tough soils and
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PKG EMI Shield Tape
PKG EMI Shield Tape (Heat-resistant Adhesive Tape) Cut off the electromagnetic interference in mobile phones and cameras
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Supra Clean D-80
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Mold Release Film
General Mold Release Film
Product Description / Properties
- Not directly contact with mold EMC when vacuum in the mold cavity - More
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SupraEtch RT Series
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IFLEX
The iFlex adds flexible production, matching the industry trend towards high-mix production. iFlex virtually eliminates product change-over times
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UV Dicing Tape
General Mold Release Film
Product Description / Properties
- To fix wafer with high adhesiveness when dicing process and easy to remove
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iX Series
The K&S iX series has continuous enhancements in the total pick and place process, further introducing a new light weight feeding range with proven
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Blue Tape
LED/ Semiconductor Dicing & Die Carrier Tape
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SupraCop HT-300
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CYBERSOLV® 141-R
PRECISION SOLVENT CLEANER
CYBERSOLV 141-R is a non-flammable, solvent-based cleaning fluid designed for bench-top cleaning needs removing
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QFN Backside Tape
Product Description
QFN (Backside Tape) tape is attached to the back of the lead frame to prevent leakage of EMC during EMC molding.
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SupraCop HT-500
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CYBERSOLV® C8502
PRECISION SOLVENT CLEANER
CYBERSOLV C8502 is specially formulated to quickly remove all types of flux residues from wave solder fingers, reflow
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