Mold Release Film

Application:

• Keeps mold tool clean from substances such as silicone or epoxy
• Can be used over 200℃ high temperature
• Superior release performance without resin in cavity
• Adaptable to matt type for semiconductor packing or glossy type for LED manufacturing
• Can be modified according to a customer’s individual requirements (Thickness, Matte etc.)

* Compression Mold Diagram

RELEASE FILM

Product Description / Properties:

• Excellent release properties, combined with high elongation
• Excellent mechanical stability at high temperatures
• MNR-E50-GY-L / High elongation film for LED package (over 700% in 175℃)
• High-tear –and tear propagation strength
• Excellent release behavior
• Excellent antiadhesivity
• Suitable for all commonly used resin system

Application:

• Manufacturing in the semiconductor industry

Anti-Static Mold Release Film(EDS Process)

Product Description / Properties:

• To give Anti-Static property maintaining the release properties from existing mold release film
• Compose of electro-conductivity material of thin fit between film layer
• Electro-conductive material gets electricity flow improved and block static electricity

Properties:

• Semi-permanent maintenance of anti-static function
• Maintaining its anti-static function at high temperature process

Product Structure

* Exposed Die FCCSP Diagram