This P-512 is a special purpose wrapping film which makes protective layer on sensitive wafer surface that is developed to protect from arising particle and damage during processing.
Protecting wafer surface as it is excellent for the fraction defective control from contaminations that may occur when it moves on or wait for processing after completion of processing such as Wafer Level Package, CSP package or etc.
It effectively controls corrosion caused by oxidation that occurs between moisture in the air and chips during long-term storage of Wafer Level Package completed the process.
After sawing process of Wafer Level Package, it controls damage and dust by making protective layer on PKG in SMT process. (No deformation or melting bubbles due to excellent heat resistance in reflow process that may heat it up to 250℃)
Excellent rinse effect as a water-soluble product, easy to remove wrapping film, dust and contamination
Mainly used for sensor surface protection and applicable to various sensitive materials to dust and contamination. (ex, LCD panel protection purpose, Glass protection purpose in