PKG EMI Shield Tape 
Mold Release Film
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- +63 (49) 554-9360
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General Mold Release Film
Product Description / Properties
- To fix wafer with high adhesiveness when dicing process and easy to remove after UV cure with decreased adhesiveness
- Remove without flouling on wafer surface
Product Description / Properties
- To fix wafer with high adhesiveness when dicing process and easy to remove after UV cure with decreased adhesiveness
- Remove without flouling on wafer surface
Application:
- LED Wafer Dicing / Semiconductor Wafer Dicing / Package(LED) Dicing)
Product Structure:
Properties:
- Strong adhesiveness, chipping, chip flying prevention
- Removed easily when die pick-up with decrease adhesiveness after UV curing
- Not remain damage or corruption on the surface of the product after UV curing
- Semiconductor/LED/Glass Package & Wafer
- PO, PE, PVC, PET Base Tape
- Have functional product of Non UV type, expandable type
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