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(49)
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(50)
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(14)
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AFluid Technology
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Hojin Platech Co. Ltd.
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Cleaner S-20
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Blue Tape
LED/ Semiconductor Dicing & Die Carrier Tape
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Supra Clean D-70
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MB PALAMAX®
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QFN Backside Tape
Product Description
QFN (Backside Tape) tape is attached to the back of the lead frame to prevent leakage of EMC during EMC molding.
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Supra Clean D-80
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ESIM PERSO
Technology for mobile high speed communication
Wearable gadgets, smart appliances and a variety of future data-sensor applications are often
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SOLDER WIRE
Fast soldering with less corrosion of soldering tip and less flux spattering which will provide greater productivity
Features:
-
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SupraEtch RT Series
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DS VARIATION ECOline
Most flexible and cost-efficient handling system
Mühlbauer’s overall goal with the DS VARIATION ecoLINE is to significantly lower the initial
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SOLDER POWDER
Fast soldering with less corrosion of soldering tip and less flux spattering which will provide greater productivity
Features:
- Highest
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SOLDER ANODE
Highest purity of tin to provide highest plating efficiency with low generation of sludges.
Features:
- Highest purity of alloy -
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AQUANOX® A4241
AQUANOX A4241 is an innovative aqueous cleaning solution developed for cleaning printed circuit boards and stencils, two (2) processes with one (1)
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DS MERLIN TAPE & REEL
The world‘s No. 1 in Die Sorting
With the latest DS Merlin, Mühlbauer was able to achieve a new record throughput of up to 45,000 UPH –
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SOLDER BAR/SOLID WIRE
Introducing 3rd generation of wave solder alloy
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AQUANOX® A4625
AQUANOX A4625 is a highly dispersive cleaning agent designed to clean electronic assemblies in spray-in-air cleaning equipment. A4625 is effective on
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SupraCop HT-300
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DS MERLIN WAFER-TO-WAFER / WAFER-TO-PANEL
High speed wafer-to-wafer / wafer-to-panel
With the new DS MERLIN, Mühlbauer was able to achieve a new record throughput of more than
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SupraClean AD-10
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AQUANOX® A4625B
AQUANOX A4625B was developed specifically to remove all types of solder pastes and flux residues from printed circuit board assemblies, including the
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SupraCop HT-500
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DS Laser
The most gentle method of die handling
With the new DS Laser, Mühlbauer has developed a particularly gentle die handling method. Instead
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