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AFluid Technology
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IFLEX
The iFlex adds flexible production, matching the industry trend towards high-mix production. iFlex virtually eliminates product change-over times
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DS MERLIN WAFER-TO-WAFER / WAFER-TO-PANEL
High speed wafer-to-wafer / wafer-to-panel
With the new DS MERLIN, Mühlbauer was able to achieve a new record throughput of more than
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KYZEN® CP90N
AQUEOUS LONG-TERM DRY FILM CORROSION PREVENTATIVE
KYZEN CP90N is an amine-free concentrated aqueous solution designed to be an effective
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Die Collets and Pick and Place Tools
Product Overview MPP will enable you to overcome your pick and place process challenges by offering:
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AQUANOX® A8820D
AQUANOX A8820D is a pour and go engineered micro-cell cleaning fluid designed to remove wet solder paste and uncured adhesive from stencils used in
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DELO-DUOPOX
DELO-DUOPOX – 2-part epoxy glue range with outstanding strength DELO offers a range of 2-component adhesives made from epoxy resin: This is a
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iX Series
The K&S iX series has continuous enhancements in the total pick and place process, further introducing a new light weight feeding range with proven
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DS Laser
The most gentle method of die handling
With the new DS Laser, Mühlbauer has developed a particularly gentle die handling method. Instead
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IONOX® FCR
HIGH–STRENGTH, SEMIAQUEOUS ELECTRONICS CLEANER
IONOX FCR is a high-strength, concentrated cleaner containing a blend of organic solvents
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Fine Wire Wedge Bonding Tools
Product Overview
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AQUANOX® A8830
AQUANOX A8830 cleans solder paste from stencil apertures in ultrasonic immersion cleaning tanks. A typical wash cycle using a 10% solution of A8830
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DELO-PUR
Polyurethane adhesive – for excellent strength
Polyurethane adhesives are two-component products for bonding plastics that cure at room
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Fluid-1200
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Production Equipment
Mühlbauer Die Sorting Setting the benchmark in WLCSP flip chip die sorting
Mühlbauer's Die Sorting systems are world leading in terms of
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MICRONOX® MX2302
HIGH–STRENGTH, SEMIAQUEOUS ELECTRONICS CLEANER
MICRONOX MX2302 is an engineered semi-aqueous solvent blend designed to remove difficult
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Heavy Wire Wedge Bonding Tools
MPP is a leading manufacturer of Heavy Wire Wedge bonding tools (HWW) and ribbon tools for large manufacturers of power devices for all types of
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METALNOX® M6060
KYZEN’s METALNOX products are Solvent and Aqueous precision cleaning metal finishing chemistries specifically formulated for removing tough soils and
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DELO-GUM
DELO-GUM: Our silicone adhesive range for reliable and flexible bonding
Sealants like DELO-GUM are available as one- and two-component
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Fluid-3000
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Fa23
- Semi-automatic programmable highly precise and flexible off line stencil printer - Suitable for SMT production with automatic camera guided
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MICRONOX® MX2322
SEMICONDUCTOR & ADVANCED PACKAGING CLEANING CHEMISTRY
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to
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