DELO KATIOBOND adhesives are predominantly used in semiconductor packaging, microelectronics, electrical engineering, optoelectronics, organic electronics, automotive and hard disk drives for bonding, coating, fixing, casting and sealing.They are characterized by the possibility of preactivation, low outgassing, dry surface, high reliability, chemical and temperature resistance. The suitability and strength of the adhesive must be verified on original components under the application-specific conditions.
Preparation of the components to be bonded
For optimal bond strength, the surfaces to be bonded must be free of dust, oil, grease, separating agents and other contaminations. Our DELOTHEN cleaners are available for this purpose. The Technical Information “Cleaners” provides more details.When using aqueous cleaners with alkaline properties, they must be removed from the bonding surface in adequate rinsing cycles after cleaning When using alkaline cleaners, a neutralization of the surface must be ensured. Alkaline surfaces can inhibit adhesive curing, resulting in poor or even no establishment of adhesion at all. In addition to wet-chemical cleaning, adhesion can be further improved by a suitable chemical and physical surface pretreatment. For more details, please refer to the Technical Information “Surface Pretreatment”. It is advantageous to preheat the two components to reduce condensation or surface humidity. Furthermore, a warm surface can improve establishment of adhesion to the surface, and therefore reduce the time until functional strength is achieved.
Application areas
Properties