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DELO MONOPOX

BS 330
Dual CCD offline dispensing system BS 330
dual_bond1
Delo Dualbond

out of stock
1c electrically conductive adhesives with excellent mechanical and electrical properties.
DELO carries a variety of one-component, high temperature adhesive options with varying chemistries. These meet many a customer's needs as there are anhydrides, aminic adhesives and mCD adhesives as well as heat-curing cationic glues and acrylates available. Due to their chemical composition, our one-component products are able to fulfill several important functions simultaneously, thus saving space and weight.
Manufacturer: DELO Categories: Bonding Technology

DELO MONOPOX, one of our electrically conductive adhesives, combines excellent conductivity with strong bonding properties – whilst being resistant to chemicals and high heat. That's why our conductive glue and potting compound range is also ideal for applications in the automotive and the (micro)electronics industries!

DELO MONOPOX MONOPOX products are one-component, heat-curing products. They are predominantly used in electronics, microelectronics, electrical engineering, precision engineering and sometimes in mechanical engineering for bonding, fixing or potting/encapsulating.

 

Preparation of the components to be bonded
The  surfaces  to  be  bonded  must  be  dry,  free  of  oil,  grease  and  other  contaminations  in  order  to  achieve  optimal  bond  strength.  You  can  find  more  details  in  the  technical information about cleaning agents.Condensation water on components must evaporate before adhesive application. Residues of the cleaning on the substrate are to be avoided.Depending on the substrate, defined drying may be necessary for optimal results.After cleaning, adhesion to the component can be further improved by surface pretreatment. The suitability and strength of the adhesive are to be verified on original components under application-specific conditions.

 

Application areas

  • Automotive
  • Consumer electronics
  • Mechanical engineering
  • Optoelectronics
  • Photovoltaics
  • RFID / Smart label
  • Semiconductor packaging
  • Smart card

 

Properties

  • One-component and heat-curing conductive glue
  • Excellent mechanical and electrical behavior
  • High resistance to chemicals and heat
  • Efficient production processes with electrically conductive adhesives
  • Optimal flow behavior, especially when it comes to 'Dam & Fill'

 

 

 

          

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