MICRONOX® MX2708
ORGANIC ACID RESIDUE CLEANING AGENT
MICRONOX MX2708 is formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitch BGAs, flip chips, QFNs, LGAs, and passives. MX2708 completely removes organic acid residue of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag, and Au finishes. MX2708 most effectively cleans organic acid flux residues at lower concentrations in spray-in-air cleaning systems.
MICRONOX MX2708 is formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitch BGAs, flip chips, QFNs, LGAs, and passives. MX2708 completely removes organic acid residue of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag, and Au finishes. MX2708 most effectively cleans organic acid flux residues at lower concentrations in spray-in-air cleaning systems.
