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SEMICONDUCTOR & ADVANCED PACKAGING CLEANING CHEMISTRY
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.
MICRONOX MX2322 is a semiconductor grade semi-aqueous solvent that is designed to clean all types of paste fluxes common in wafer bumping, wafer-level packaging, die-attach, flipchip and SiP containing copper pillar. MICRONOX MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.
MICRONOX MX2322 is used as received and rinses quickly and cleanly with DI water. MX2322 has a wide process window, as well as a long bath life providing a low cost of ownership. MICRONOX MX2322 has proven superior compatibility on exposed sensitive metals including aluminum, copper and nickel as well as passivation materials.
NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.
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