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SupraEtch RT Series

SupraSolve CD-600
Slotofin10
solder_paste
SOLDER PASTE

Usage: Soft Etching treatment

  • Enhanced adhesion of dry film by forming illuminance on copper surface
  • Excellent working environment, since there is no toxic gas or smell
  • Excellent prevention of oxidation on copper surface and water marks
  • Solution safe with sulphuric acid and hydrogen peroxide

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