DELO DUALBOND products are predominantly used in electronics, microelectronics, electrical engineering, precision engineering and sometimes in mechanical engineering for bonding, fixing or potting/encapsulating. Prefixation by means of a light source is possible. DELOLUX curing lamps are recommendable. Curing until final strength and in shadowed areas requires one heat curing step. Light fixation is optional.
Application areas
- Automotive
- Consumer electronics
- Displays
- Electronics
- Optoelectronics
- Mobile phone
Properties
- Good resistance to thermal shock
- Fast light curing and reliable curing in shadowed areas
- Universal adhesion to many substrates
- Optimum flow behavior for sealing and casting
- Range from flexible to hard
- Transparent dual cure adhesives available for large bonding areas
Adhesive application / joining / curing
- Preparation of the adhesive and the components
- Adhesive application to one component
- Joining
- Light fixation of the components at the fillet by exposure to UV or visible light in the necessary wavelength range.
- Curing of the adhesive by heat
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