The world‘s No. 1 in Die Sorting
With the latest DS Merlin, Mühlbauer was able to achieve a new record throughput of up to 45,000 UPH –

High speed wafer-to-wafer / wafer-to-panel
With the new DS MERLIN, Mühlbauer was able to achieve a new record throughput of more than

The most gentle method of die handling
With the new DS Laser, Mühlbauer has developed a particularly gentle die handling method. Instead

Mühlbauer Die Sorting Setting the benchmark in WLCSP flip chip die sorting
Mühlbauer's Die Sorting systems are world leading in terms of

Fast soldering with less corrosion of soldering tip and less flux spattering which will provide greater productivity Features: -