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CYBERSOLV® C8622

METALNOX M6381
METALNOX® M6386
compaclean9
Compaclean

out of stock
SAFE/EFFECTIVE IPAALTERNATIVE SOLVENT

CYBERSOLV C8622 is a full-strength solvent blend specifically designed as an IPA alternative for under stencil wiping and manual bench top cleaning applications. C8622 is ideally suited for dissolving un-reflowed solder paste during the stencil printing process, and can be applied as received in any application where IPA is typically used.
Manufacturer: Kyzen Categories: Precision Cleaning, Chemicals

CYBERSOLV C8622 improves stencil printing yields by removing trace solder paste deposits from the stencil aperture. C8622 is safe and effective in all IPA applications, boasting extensive compatibility and low odor. CYBERSOLV C8622 dries spot free and does not require a rinsing step, however, if needed, use fresh C8622 or Hot DI Water.

 

NOTE: The above process parameters are recommendations based on extensive testing done in KYZEN’s application lab. Your KYZEN sales representative can assist you in optimizing your process parameters.

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