With the completely automatic self-alignment system, a complex and long-lasting operator-related changeovers and set-up times are no longer required. New products can be introduced faster and easier than ever before. Due to the new construction, the inspection system with latest IR technology on sidewall and backside inspection reaches an even higher output quality. A more intuitive software interface and an enhanced wafer handling complete this brand new die sorting system.
Key Features
» Beating the 12.000 UPH
» Ready for ultra-thin die handling (down to 20 µm)
» Pick-from-glass capability
Benifits
» Defect detection of 9µm defects and 5µm on sidewall
» Infrared: sidewall and backside IR inspection.
THROUGHPUT: